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Equipped with a full suite of microchannel machining, vacuum brazing, and thermal testing capabilities, covering the entire process from cold plate forming to performance validation. Focused on 1000W-2500W high-power AI chip heat dissipation, offering aluminum-based/copper-based cold plates, with support for 10-day prototyping through mass production ramp-up. Process parameters are fully controllable across the entire chain, with thermal resistance and helium inspection data traceable, shortening validation cycles and reducing introduction risks.

With full-chain manufacturing capabilities in precision forming, connection sealing, and performance validation, we adapt to diverse AI computing heat dissipation architectures. Covered scenarios include high-power-density GPUs, non-standard domestic AI chips, and modular cloud provider ASICs. Support for irregular flow channels and multi-interface compatibility, aluminum-based/copper-based cold plate mass production delivery, and composite material technology reserves.

Collaborated with industry-leading customers to complete 1000W-2500W-class AI chip cold plate sample delivery, familiar with the full-process collaboration rhythm from drawings to samples.

Offering aluminum-based mainstream solutions (lightweight, cost-controllable) and copper-based high-performance solutions (lower thermal resistance), adapting to different power density requirements.

Thermal resistance testing, helium mass spectrometer leak detection, and other inspection reports are provided at the sample stage. Data is reproducible, providing technical documentation for SQE review.

Cold plate flow channels need adjustment with chip iteration; after receiving change requests, process feasibility is quickly evaluated and machining plans adjusted, shortening sample cycles.